Thermal Stress Calculation in Micro-Electronic Devices

Application Area

Thermal finite element analysis (FEA) of microelectronic equipment based on computational fluid dynamics (CFD) analysis data.
 

Our Solution


MpCCI FSIMapper as file-based mapping tool offers advanced and robust interpolation methods to transfer CFD analysis data onto an arbitrary FEA. Incompatible mesh discretization and also geometry deviations are automatically handled and mapped data is stored into native FEA solver format.

© Photo Fraunhofer SCAI

Thermal mapping example for Micro-Electronic Devices

MpCCI FSIMapper

The MpCCI FSIMapper maps simulation results from a source to a target mesh. The following two tables list the supported source and target file formats for this application area.

 

Source Formats

Quantities

CFD

  • FloEFD (.efdfea)
  • FloTHERM (.flofea)
  • FloTHERM XT (.txt)
  • ANSYS IcePak (.cas, .dat)

temperature

heat flux

film temperature, heat coeff.

 

 

Target Formats

Target Analyses

FEM

  • Abaqus
  • ANSYS Mech.
  • Nastran

deformation

stress

heat transfer

fatigue


List of additionally supported source and target file formats