Thermal Stress Calculation in Micro-Electronic Devices

Application Area

Thermal finite element analysis (FEA) of microelectronic equipment based on computational fluid dynamics (CFD) analysis data.

Our Solution

MpCCI FSIMapper as file-based mapping tool offers advanced and robust interpolation methods to transfer CFD analysis data onto an arbitrary FEA. Incompatible mesh discretizations and also geometry deviations are automatically handled and mapped data is stored into the native FEA solver format.

FSIMapper Product sheet [PDF 0.72 MB]

© Fraunhofer SCAI
Thermal mapping example for Micro-Electronic Devices

MpCCI FSIMapper

The MpCCI FSIMapper maps simulation results from a source to a target mesh. The following two tables list the supported source and target file formats for this application area.

	Source Formats	Quantities
CFD	FloEFD (.efdfea) FloTHERM (.flofea) FloTHERM XT (.txt) ANSYS IcePak (.cas, .dat)	temperature heat flux film temperature, heat coeff.

Source Formats

Quantities

CFD

FloEFD (.efdfea)
FloTHERM (.flofea)
FloTHERM XT (.txt)
ANSYS IcePak (.cas, .dat)

temperature

heat flux

film temperature, heat coeff.

	Target Formats	Target Analyses
FEM	Abaqus ANSYS Mech. Nastran	deformation stress heat transfer fatigue

Target Formats

Target Analyses

FEM

Abaqus
ANSYS Mech.
Nastran

deformation

stress

heat transfer

fatigue

List of additionally supported source and target file formats

Online Demo

Thermal mapping example for micro-electronic devices - transfering results from FloTHERM simulation (*.flofea) to an Abaqus input model (*.inp).